Modem: Qualcomm announces world’s first 5G advanced-ready Modem-RF system – Times of India
Qualcomm has unveiled a series of 5G products which include the Snapdragon X75, X72 5G Modem-RF Systems and the Qualcomm Fixed Wireless Access Platform Gen 3. These platforms will power the Connected Intelligent Edge and claim to enable 5G connectivity experiences across a wide range of industries. Snapdragon X75 5G Modem-RF system is the world’s first 5G Advanced-ready Modem-RF System. It claims to drive 5G evolution in key industries including vehicles, PCs, Industrial IoT and more. Powered by Snapdragon X75, Qualcomm Fixed Wireless Access Platform Gen 3 is the world’s first fully integrated 5G Advanced-ready fixed wireless access platform for 5G fixed internet access.
Snapdragon X75 and X72 5G Modem-RF systems
This modem-to-antenna solution from Qualcomm is the first 5G Advanced system. It introduces a new architecture and a software suite that includes multiple connectivity features like coverage, latency, power efficiency and mobility.
Snapdragon X75 claims to empower OEMs to create next-generation experiences across segments including smartphones, mobile broadband, automotive, compute, industrial IoT, fixed wireless access and 5G private networks.
Snapdragon X75 is the first Modem-RF System with a dedicated hardware tensor accelerator, the Qualcomm 5G AI Processor Gen 2. This accelerator claims to offer over 2.5 times better AI performance compared to Gen 1.
It also introduces Qualcomm 5G AI Suite Gen 2 which has AI-powered optimisations to achieve better speeds, coverage, mobility, link robustness and location accuracy. The Qualcomm 5G AI Suite features advanced AI-based capabilities including the world’s first sensor-assisted mmWave beam management and AI-based GNSS Location Gen 2, which optimises the Snapdragon X75 to offer better 5G performance.
The Snapdragon X75 is powered by a new modem-to-antenna upgradeable architecture, is designed for scalability and offers improved 5G performance with key features such as — the world’s first 10-carrier aggregation for mmWave, 5x downlink carrier aggregation and FDD uplink MIMO for sub-6 GHz bands, which allow for better spectrum aggregation and capacity.
It has a converged transceiver for mmWave and sub-6 paired with new Qualcomm QTM565 fifth-generation mmWave antenna modules that claim to reduce cost, board complexity, hardware footprint and power consumption.
Qualcomm Advanced Modem-RF Software Suite further improves sustained performance, across user scenarios including elevators, subway trains, airports, parking garages, mobile gaming sessions and more. AI-based sensor-assisted mmWave beam management offers improved connectivity reliability and AI-based location accuracy enhancements.
Moreover, the Qualcomm 5G PowerSave Gen 4 and Qualcomm RF Power Efficiency Suite offers extended battery life while the Qualcomm DSDA Gen 2 support enables 5G/4G Dual Data on two SIM cards, simultaneously. Furthermore, the Qualcomm Smart Transmit Gen 4 allows for fast, reliable and long-range uploads along with support for Snapdragon Satellite.
Qualcomm Fixed Wireless Access Platform Gen 3
Qualcomm Fixed Wireless Access Platform Gen 3 is powered by the Snapdragon X75 system. It is the first fully integrated 5G Advanced-ready fixed wireless access (FWA) platform with mmWave, Sub-6 GHz, and Wi-Fi 7 support, including 10Gb Ethernet capability.
This platform is powered by a quad-core CPU and dedicated hardware acceleration designed to support peak performance across 5G cellular, Ethernet and Wi-Fi. With these capabilities, Qualcomm FWA Gen 3 platform will enable the next-gen all-wireless broadband that delivers multi-gigabit speeds and wire-like latency to nearly all home devices.
Additionally, Qualcomm FWA Gen 3 will help enable a wide range of apps and value-added services for mobile operators and provide them with a cost-effective way to deliver fibre-like internet speeds wirelessly over 5G to rural, suburban and dense urban communities. This will help in driving the global adoption of FWA.
Qualcomm FWA Gen 3 also features Converged mmWave-Sub-6 hardware architecture to reduce footprint, cost, board complexity, and power consumption. It offers Qualcomm Dynamic Antenna Steering Gen 2 for enhanced self-install capabilities and the Qualcomm RF Sensing Suite to enable indoor mmWave CPE deployments.
The FWA Gen 3 also includes Qualcomm Tri-Band Wi-Fi 7 that supports up to 320MHz channels with improved Multi-Link operation for faster, reliable connections with lower latencies and mesh capability for better coverage.
It also has a software architecture that supports multiple frameworks, including OpenWRT and RDK-B. With the Dual SIM option, the Gen3 platform supports both 5G Dual-SIM Dual Active (DSDA) and Dual-SIM Dual Standby (DSDS) configurations.
Snapdragon X75 and X72 5G Modem-RF systems
This modem-to-antenna solution from Qualcomm is the first 5G Advanced system. It introduces a new architecture and a software suite that includes multiple connectivity features like coverage, latency, power efficiency and mobility.
Snapdragon X75 claims to empower OEMs to create next-generation experiences across segments including smartphones, mobile broadband, automotive, compute, industrial IoT, fixed wireless access and 5G private networks.
Snapdragon X75 is the first Modem-RF System with a dedicated hardware tensor accelerator, the Qualcomm 5G AI Processor Gen 2. This accelerator claims to offer over 2.5 times better AI performance compared to Gen 1.
It also introduces Qualcomm 5G AI Suite Gen 2 which has AI-powered optimisations to achieve better speeds, coverage, mobility, link robustness and location accuracy. The Qualcomm 5G AI Suite features advanced AI-based capabilities including the world’s first sensor-assisted mmWave beam management and AI-based GNSS Location Gen 2, which optimises the Snapdragon X75 to offer better 5G performance.
The Snapdragon X75 is powered by a new modem-to-antenna upgradeable architecture, is designed for scalability and offers improved 5G performance with key features such as — the world’s first 10-carrier aggregation for mmWave, 5x downlink carrier aggregation and FDD uplink MIMO for sub-6 GHz bands, which allow for better spectrum aggregation and capacity.
It has a converged transceiver for mmWave and sub-6 paired with new Qualcomm QTM565 fifth-generation mmWave antenna modules that claim to reduce cost, board complexity, hardware footprint and power consumption.
Qualcomm Advanced Modem-RF Software Suite further improves sustained performance, across user scenarios including elevators, subway trains, airports, parking garages, mobile gaming sessions and more. AI-based sensor-assisted mmWave beam management offers improved connectivity reliability and AI-based location accuracy enhancements.
Moreover, the Qualcomm 5G PowerSave Gen 4 and Qualcomm RF Power Efficiency Suite offers extended battery life while the Qualcomm DSDA Gen 2 support enables 5G/4G Dual Data on two SIM cards, simultaneously. Furthermore, the Qualcomm Smart Transmit Gen 4 allows for fast, reliable and long-range uploads along with support for Snapdragon Satellite.
Qualcomm Fixed Wireless Access Platform Gen 3
Qualcomm Fixed Wireless Access Platform Gen 3 is powered by the Snapdragon X75 system. It is the first fully integrated 5G Advanced-ready fixed wireless access (FWA) platform with mmWave, Sub-6 GHz, and Wi-Fi 7 support, including 10Gb Ethernet capability.
This platform is powered by a quad-core CPU and dedicated hardware acceleration designed to support peak performance across 5G cellular, Ethernet and Wi-Fi. With these capabilities, Qualcomm FWA Gen 3 platform will enable the next-gen all-wireless broadband that delivers multi-gigabit speeds and wire-like latency to nearly all home devices.
Additionally, Qualcomm FWA Gen 3 will help enable a wide range of apps and value-added services for mobile operators and provide them with a cost-effective way to deliver fibre-like internet speeds wirelessly over 5G to rural, suburban and dense urban communities. This will help in driving the global adoption of FWA.
Qualcomm FWA Gen 3 also features Converged mmWave-Sub-6 hardware architecture to reduce footprint, cost, board complexity, and power consumption. It offers Qualcomm Dynamic Antenna Steering Gen 2 for enhanced self-install capabilities and the Qualcomm RF Sensing Suite to enable indoor mmWave CPE deployments.
The FWA Gen 3 also includes Qualcomm Tri-Band Wi-Fi 7 that supports up to 320MHz channels with improved Multi-Link operation for faster, reliable connections with lower latencies and mesh capability for better coverage.
It also has a software architecture that supports multiple frameworks, including OpenWRT and RDK-B. With the Dual SIM option, the Gen3 platform supports both 5G Dual-SIM Dual Active (DSDA) and Dual-SIM Dual Standby (DSDS) configurations.
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