Mediatek: MediaTek Dimensity 9200+ SoC for flagship smartphones launched: All details – Times of India

MediaTek has expanded its Dimensity chipset portfolio and launched the Dimensity 9200+ SoC for flagship 5G smartphones. The Taiwanese company said that the new offering offers a performance upgrade over its predecessor while maintaining power efficiency for longer battery life and better gaming experiences.
MediaTek said that smartphones powered by the Dimensity 9200+ are expected to be released in May 2023. The company, however, did not reveal the name of any OEM that will bring the latest SoC in their offerings.
“We continue to raise the bar for flagship performance and power efficiency with the Dimensity 9200+, ensuring device makers have access to the most powerful mobile gaming features available today,” said Yenchi Lee, deputy general manager of MediaTek’s Wireless Communications Business Unit.

MediaTek Dimensity 9200+ architecture
According to MediaTek, the Dimensity 9200+ supports higher clock speeds than its predecessor, the Dimensity 9200 chipset. The Dimensity 9200+ gets an ultra-core Arm Cortex-X3 operating at up to 3.35GHz, three Arm Cortex-A715 super-cores running up to 3.0GHz, and four Arm Cortex-A510 efficiency cores at 2.0GHz.
MediaTek added the chipset’s Arm Immortalis-G715 GPU by 17% to provide the SoC an additional boost for gaming and other compute-intensive applications.
“With faster raytracing and fluid gameplay at high frame rates, combined with MediaTek’s power saving technologies, you can enjoy incredible visuals, epic effects and extended battery life,” Lee added.

MediaTek Dimensity 9200+ connectivity
The Dimensity 9200+ has a 4CC-CA 5G Release-16 modem that switches between sub-6GHz and mmWave connections, the company said. Additionally, the chipset also supports Wi-Fi 7 2×2 + 2×2 with up to 6.5Gbps data rate and Bluetooth 5.3. It comes with MediaTek’s Bluetooth and Wi-Fi coexistence technology which allows Wi-Fi, Bluetooth low energy (LE) audio and wireless peripherals to connect at the same time with low latency and without inference.
MediaTek Dimensity 9200+ key features:
HyperEngine 6.0: MediaTek Dimensity 9200+ gets the HyperEngine 6.0 that is responsible for improving the gaming experience with adaptive performance technology.
4nm manufacturing: The MediaTek Dimensity 9200+ is manufactured with second generation TSMC 4nm-class process which makes it an ideal offering for “ultra-slim designs in a variety of form factors.”
Sixth generation AI Processing Unit (APU 690): MediaTek Dimensity 9200+ is said to efficiently power AI-noise reduction and AI-super resolution tasks for videos and Bokeh shots.
Imagiq 890: MediaTek Dimensity 9200+ gets Imagiq 890 image signal processor for bright, sharp images and videos even in low-light scenarios.
MediaTek MiraVision 890: The display technology is claimed to offer a fluid user experience.
MediaTek 5G UltraSave 3.0: The SoC gets this power efficiency technology to optimise battery life for 5G connection conditions.